This standard specifies the general methods for destructive physical analysis (DPA) of military electronic components, including the general requirements of DPA programs, as well as the general methods and defect criteria for DPA testing and analysis of typical electronic components. This standard is applicable to military electronic components with DPA requirements. 2. The relevant clauses in the following documents become the clauses of this standard through reference. Any reference document with a date or revision is not applicable to this standard, and any subsequent amendments (excluding corrected content) or revisions are not applicable. However, parties advocating the use of this standard are exploring the possibility of using its latest version. For referenced documents without date or revision, the latest version applies to this standard. GJB 33A-1997 General Specification for Semiconductor Discrete Devices GJB 63B-2001 General Specification for Solid Electrolyte Button Capacitors with Reliability Indicators GJB 65B-1999 General Specification for Electromagnetic Relays with Reliability Indicators GJB 101A-1997 General Specification for Environmental Resistant Quick Separation Small Circular Electrical Connectors GJB 128A-1997 Test Methods for Semiconductor Discrete Devices GJB 142A-1994 General Specification for Small Rectangular Electrical Connectors with Housing Positioning for Cabinets GJB 176-196 Environmental Resistant Spring Hole Rectangular Electrical Connectors General specification GJB 177A-1999 General specification for crimping contact rectangular electrical connectors GJB 191A-1997 General specification for mica capacitors with reliability indicators GJB 192A-1998 General specification for unclosed multilayer ceramic dielectric capacitors with reliability indicators GJB 244A-2001 General specification for fixed film resistors with quality grades GJB 360A-1996 Test methods for electronic and electrical components GJB 468-1988 General specification for Class 1 ceramic dielectric capacitors with and without reliability indicators GJB 548A-1996 Test methods and procedures for microelectronic devices GJB 597A-1996 General specification for semiconductor integrated circuits GJB 598A-1996 General specification for environmental fast separation circular electrical connectors GJB 599A-1993 General specification for environmental fast separation high-density small circular electrical connectors GJB 601-1988 General specification for thermistors GJB 675A-2002 General specification for RF molded fixed coils with and without reliability indicators GJB 681A-2002 General specification for RF coaxial connectors GJB 728-1989 Glass General specification for dielectric fine tuned variable capacitors GJB 732-1990 Plastic film (or paper plastic film) with reliability indicators Dielectric (sealed with metal, ceramic or glass shells) General specification for capacitors GJB 733A-1996 General specification for non solid electrolyte button capacitors with reliability indicators GJB 809A-1997 General specification for microswitches GJB 917-1990 General specification for wire wound pre adjustable potentiometers GJB 918-1990 General specification for non wire wound pre adjustable potentiometers GJB 920-1990 General specification for film fixed resistance networks GJB 924-1990 General specification for class 2 ceramic capacitors with reliability indicators
Function of testing report:
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1. Telephone communication and confirmation of requirements
2. Recommend solutions and confirm quotations 3. Mail samples and arrange testing 4. Progress tracking and result feedback 5. Provide reports and after-sales service 6. If urgent or priority processing is requiredTesting and testing characteristics:
1. The testing industry is fully covered, meeting different testing needs
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