Electronics
Failure Analysis and Detection of Semiconductor Integrated Circuits
Failure Analysis and Detection of Semiconductor Integrated Circuits
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Failure Analysis and Detection of Semiconductor Integrated Circuits

This standard specifies the preparation, analysis procedures, analysis methods, and processing of analysis results before failure analysis of semiconductor integrated circuits

1.2 Scope of Application

This standard is applicable to semiconductor integrated circuits (hereinafter referred to as devices). 1.3 Application Guidelines

This standard specifies three different levels of analytical procedures and methods that can be used in the laboratory. Failure analysis personnel should choose the corresponding analysis program and method based on factors such as device model, packaging form, reliability level, and requirements of the commissioning unit

2 References

GJB 548A-96 Test Methods and Procedures for Microelectronic Devices 3 Definitions

3.1 Defects

Any inconsistency with the detailed technical specifications in terms of appearance, assembly, function, or process quality.

. 3.2 Screenable defects

Defects that can be eliminated using effective screening methods. 3.3 Batch defects Lot related defects

Defects caused during the design and manufacturing process and repeated multiple times in the same batch of devices (such as: thickness of metallization layer, bonding strength, insulation material performance, metallization wiring, improper spacing between bonding leads, and between bonding leads and chip edges, or mask defects)

3.4 Failure Mode

The manifestation of device failure.

3.5 Failure mechanism

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Testing and testing characteristics:

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