Electronics
Failure Analysis and Detection of Semiconductor Discrete Devices
Failure Analysis and Detection of Semiconductor Discrete Devices
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Failure Analysis and Detection of Semiconductor Discrete Devices

1 Scope

1.1 Topic Content

This standard specifies the methods and general procedures for conducting failure analysis of semiconductor discrete devices in the laboratory. 1.2 Scope of Application

This standard is applicable to the failure analysis of semiconductor discrete devices (hereinafter referred to as devices). 1.3 Application Guidelines

When conducting failure analysis, the failure analysis method and program to be used should be determined based on factors such as the type, structure, failure mode, and failure mechanism of the failed device. The failure analysis program provided in this standard allows analysts to conduct failure analysis work based on it, and they can also modify the analysis program appropriately according to actual work conditions to achieve the analysis purpose

2 References

GJB 128A-97

Test Methods for Discrete Semiconductor Devices

GJB 360A-96

Test Methods for Electronic and Electrical Components

GJB548A -96

Test Methods and Procedures for Microelectronic Devices

Definition

3.1 Defects

Any inconsistency with detailed specifications in terms of appearance, assembly, function, or process quality.

. 3.2 Screenable defects Screenable defects that can be eliminated using screening and inspection methods. 3.3 Batch related defects are defects caused by the design and manufacturing process and repeated in the same batch of devices. 3.4 Latent defects

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