Optoelectronic devices are various functional devices made using the photoelectric conversion effect, which can achieve functions such as optical signal generation, signal modulation, detection, connection, energy splitting, energy increase or decrease, signal amplification, photoelectric conversion, and electro-optic conversion. Usually, reliability testing is required for products in most industries, and the testing needs of each industry are also different. So, what reliability testing projects should be done for most optoelectronic components? Below is a brief introduction for your reference

Test items for physical characteristics of optoelectronic components:

1. Internal water vapor: Determine the water vapor content in the gas inside metal or ceramic packaged optoelectronic devices.

2. Sealing: Determine the airtightness of optoelectronic device packaging with internal cavities 3. ESD width: Determine the sensitivity and sensitivity of optoelectronic devices to damage and degradation caused by electrostatic discharge 4. Flammability: Determine the flammability of materials used in optoelectronic devices

5. Shear force: Determine the integrity of the materials and processes used to install chips and passive components of optoelectronic devices on tube sockets or other substrates 6. Solderability: Determine the solderability of optoelectronic device leads (leads with a diameter less than 30175mm and flat leads with equivalent cross-sectional area) that need to be soldered 7. Wire bonding strength: Determine the wire bonding strength of optoelectronic devices using technologies such as low-temperature welding, hot pressing welding, and ultrasonic welding

Mechanical integrity test items for optoelectronic components:

1. Mechanical impact: Determine whether optoelectronic components can be suitable for electronic equipment that needs to withstand moderate severity impacts.

. Impact may be caused by sudden force or severe vibration during loading, unloading, transportation, or on-site use 2. Variable frequency vibration: Determine the impact of vibration on various components of optoelectronic devices within the standard frequency range 3. Thermal shock: Determine the resistance and effects of optoelectronic devices to temperature fluctuations 4. Durability of insertion and extraction: Determine whether the insertion and extraction of optical fiber connectors for optoelectronic devices, as well as the parameters of optical power, loss, and reflection, meet the repeatability requirements 5. Storage test: Determine whether optoelectronic devices can withstand transportation and storage at high and low temperatures 6. Temperature cycling: Determine the ability of optoelectronic devices to withstand extremely high and low temperatures, as well as the impact of alternating changes in temperature on optoelectronic devices 7. Constant humidity and heat: Determine whether sealed and unsealed optoelectronic devices can withstand the specified temperature and humidity simultaneously 8. High temperature life: Determine the failure mechanism and working life of high-temperature accelerated aging of optoelectronic devices

Accelerated aging test for optoelectronic components:

Apply high temperature, high humidity, and a certain driving current to the optoelectronic components for accelerated aging.

. Based on the results of the experiment, it is determined that the optoelectronic device has function and loss of function, as well as acceptance and rejection, and the working conditions of the optoelectronic device can be adjusted and the reliability can be calculated 1. High temperature accelerated aging: The most basic environmental stress type during the accelerated aging process is high temperature. During the experiment, the selected parameters should be regularly monitored until degradation exceeds the end of life 2. Constant temperature test: The constant temperature test is similar to the high temperature operation test, and the number of samples and the allowable number of failures for the constant temperature test should be specified 3. Variable temperature test: The high-temperature accelerated aging test with variable temperature is a periodic and gradual increase in temperature (such as 60 ℃, 85 ℃, and 100 ℃) 4. Temperature cycling: In addition to conducting temperature cycling on optoelectronic devices as an environmental stress test, temperature cycling can also accelerate the aging of tube electronic devices The purpose of accelerated aging under temperature cycling is generally not to cause degradation of specific performance parameters, but to provide additional explanations for the long-term mechanical stability of the optical path encapsulated in the component