DPA testing (Destructive Physical Analysis) is the entire process of sampling according to the production batch of components, dissecting the samples, and conducting a series of inspections and analyses before and after dissection to verify whether the design, structure, materials, and manufacturing quality of components meet the requirements of the intended use or relevant specifications. It can determine whether there is a possibility of component batch quality issues that may endanger use and lead to serious consequences. DPA technology is widely used in military and civilian electronic components, and is of great significance in procurement inspection, incoming inspection, and quality monitoring during the production process The main function of DPA detection is to prevent failure and prevent components with obvious or potential defects from being used on the machine 2. Identify deviations and process defects in the design and manufacturing process of components 3. Inspect and verify the quality of the supplier's components 4. Propose batch handling suggestions and improvement measures DPA detection and analysis project:
1) External visual inspection
2) X-ray inspection
3) Ultrasonic inspection C-SAM
4) Cross section
5) Open De cap
6) SEM/EDS
7) Internal visual inspection
8) Pull test
9) Wire bonding strength
10) Chip bonding strength Attachments St Length
11) Chip shear strength
12) Terminal strength
13) Airproof check
14) Physical check
15) Contact check
16) Sampling with Microscope
17) Particle collision noise PIND
18) Internal atmosphere content
DPA according to standards:
1) GJ B548B-2005 Test Methods and Procedures for Microelectronic Devices
2) GJB4027A-2006 Destructive Physical Analysis Methods for Military Electronic Components
3) GJB360B-2009 Test Methods for Electronic and Electrical Components
4) GJB128A-97 Test Methods for Discrete Semiconductor Devices
5) GB/T17359-1998 General Rules for Quantitative Analysis of Electron Probe and Scanning Electron Microscope X-ray Energy Spectrum
6) IPC-TM-65021.1 Manual Microsection Method
7) EIA/ECA-469-DSTANDARD TEST HOD FOR DESTRUCTIVEPHYSICAL ANALYSIS (DPA) OF CEMIC MONOLITHIC
8) MIL-STD-883H-2010 Test Methods and Procedures for Microcircuits
or DevicesFunction of testing report:
1. Project bidding: Issue authoritative third-party CMA/CNAS qualification report
2. Online e-commerce platform entry: Quality inspection report recognized by major e-commerce platforms 3. Used as a sales report: issuing legally effective testing reports to make consumers more confident 4. Papers and research: Provide professional personalized testing needs 5. Judicial services: providing scientific, fair, and accurate testing data 6. Industrial problem diagnosis: Verify the troubleshooting and correction of industrial production problemsBaijian and testing process:
1. Telephone communication and confirmation of requirements
2. Recommend solutions and confirm quotations 3. Mail samples and arrange testing 4. Progress tracking and result feedback 5. Provide reports and after-sales service 6. If urgent or priority processing is requiredTesting and testing characteristics:
1. The testing industry is fully covered, meeting different testing needs
2. Fully cover the laboratory and allocate localized testing nearby3. Engineers provide one-on-one services to make testing more accurate
4. Free initial testing, with no testing fees charged
5. Self service order delivery for free on-site sampling
6. Short cycle, low cost, and attentive service 7. Possess authoritative qualifications such as CMA, CNAS, CAL, etc 8. The testing report is authoritative and effective, and is generally used in China