X-ray can detect various defects in LED packaging, and I hope it will be beneficial to you. The chip is the most crucial part of LED, directly determining its performance. Especially for high-end LEDs used in automobiles or solid-state lighting equipment, product quality defects are absolutely not allowed, and the reliability requirements for such equipment are very high. The damage of LED chips can directly lead to LED failure, and the chip electrodes are prone to quality defects during the welding process. The chip electrodes themselves are not firmly evaporated, resulting in electrode detachment or damage after soldering. The chip electrodes themselves have poor solderability, which can lead to solder ball failure LED chips: Any small differences in the production process will directly affect the quality of LED packaging. In order to improve the packaging quality of products, it is necessary to detect the packaging quality of chips in each production process to maximize the control of inferior products and waste products. The LED packaging factory will use X-ray non-destructive testing equipment to test chip materials. Prevent inferior chips from entering the warehouse and avoid overall loss of lamp beads caused by chip quality issues. From the perspective of the packaging process of light-emitting diodes, it is possible to cause damage to the chip during chip expansion, glue preparation, and crystallization, affecting all the optical and electrical characteristics of the light-emitting diode. However, during the fixation of the crystal and pressure welding process of the bracket, there may be chip misalignment, poor contact of the inner electrode, false soldering of the outer electrode leads, or welding stress. Chip misalignment affects the distribution and efficiency of the output light field, while poor contact or faulty soldering of the inner and outer electrodes can increase the contact resistance of the light-emitting diode. During the filling and epoxy curing processes, bubbles and thermal stress may occur, affecting the output light efficiency of light-emitting diodes. Author: Ruimao Optics https://www.bilibili.com/read/cv16589809/ Source: Bilibili