This standard specifies the product classification, terminology, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, etc. of silicon single crystal cutting and grinding sheets (referred to as silicon wafers). This standard applies to circular silicon wafers prepared by cutting and double-sided grinding of Czochralski, floating zone melting, and neutron transmutation doped silicon single crystals. The product is mainly used for making semiconductor devices such as transistors and rectifiers, or for further processing into polished wafers. The clauses in the following documents are referred to as provisions of this standard through normative references. All subsequent amendments (excluding corrected content) or revised versions of referenced documents that are dated are not applicable to this standard. However, parties to agreements based on this standard are encouraged to study whether the latest versions of these documents can be used. The latest version of any referenced document that is not dated is applicable to this standard. GB/T 1550 Test Methods for Conductivity Types of Non intrinsic Semiconductor Materials GB/T 1552 Silicon Determination of resistivity of germanium single crystal by the straight row four probe method GB/T 1554 Chemical preferred corrosion testing method for silicon crystal integrity GB/T 1555 Semiconductor single crystal orientation determination method GB/T 2828.1 Counting sampling inspection procedure Part 1: Acceptance quality limit (AQL) Batch by batch inspection sampling plan for retrieval GB/T 6616 Semiconductor silicon wafers - Determination of resistivity and thin film resistance - Non contact eddy current method GB/T 6618 Test method for thickness and total thickness change of silicon wafers GB/T 6620 Non contact test method for warpage of silicon wafers GB/T 6624 Visual inspection method for surface quality of silicon polished wafers GB/T 11073 Measurement method for radial resistivity change of silicon wafers GB/T 12962 Silicon single crystal GB/T 12964 Silicon single crystal polished wafers GB/T 13387 Electronic material wafer parameters Test Method for Surface Length GB/T 13388 Reference Surface Crystallographic Orientation X-ray Measurement Method for Silicon wafers GB/T 14140 Measurement Method for Diameter of Silicon wafers (All Parts) GB/T 14844 Semiconductor Material Grade Representation Method YS/T 26 Inspection Method for Edge Profile of Silicon wafers
Function of testing report:
1. Project bidding: Issue authoritative third-party CMA/CNAS qualification report
2. Online e-commerce platform entry: Quality inspection report recognized by major e-commerce platforms 3. Used as a sales report: issuing legally effective testing reports to make consumers more confident 4. Papers and research: Provide professional personalized testing needs 5. Judicial services: providing scientific, fair, and accurate testing data 6. Industrial problem diagnosis: Verify the troubleshooting and correction of industrial production problemsBaijian and testing process:
1. Telephone communication and confirmation of requirements
2. Recommend solutions and confirm quotations 3. Mail samples and arrange testing 4. Progress tracking and result feedback 5. Provide reports and after-sales service 6. If urgent or priority processing is requiredTesting and testing characteristics:
1. The testing industry is fully covered, meeting different testing needs
2. Fully cover the laboratory and allocate localized testing nearby3. Engineers provide one-on-one services to make testing more accurate
4. Free initial testing, with no testing fees charged
5. Self service order delivery for free on-site sampling
6. Short cycle, low cost, and attentive service 7. Possess authoritative qualifications such as CMA, CNAS, CAL, etc 8. The testing report is authoritative and effective, and is generally used in China