Reject non-conforming batches based on DPA results and retain qualified batches. Destructive Physical Analysis (DPA) is one of the important methods for ensuring the quality of components used in highly reliable engineering. It is mainly used for evaluating the batch quality of components and is also suitable for quality monitoring in the production process of components. DPA can identify issues that may not necessarily be exposed during routine screening inspections, mainly related to defects in product design, structure, assembly, and other processes. Due to the technical characteristics of destructive physical analysis technology, conducting DPA on military electronic components can expose problems in advance and effectively prevent overall failure of model engineering due to potential quality issues of electronic components. For the problems exposed in DPA, as long as the component manufacturing factory and DPA laboratory closely cooperate, analyze and track, accurately identify the causes of defects, and take targeted corrective measures, most defect modes can be controlled or eliminated. Destructive Physical Analysis (DPA) technology is not only applicable to military electronic components, but also to civilian electronic components. DPA technology can be applied to procurement inspection, incoming inspection, and quality monitoring during production processes